Semiconductor integtrated circuit including test pads

ABSTRACT

A The semiconductor integrated circuit includes a test input/output port including test pads; an internal input interface configured to generate an internal clock, an internal address, an internal command, internal data and temporary storage data in response to external signals through the test input/output port; and an error detection block configured to determine whether the internal data and the temporary storage data are the same, and output a result through one test pad of the port. The internal input interface includes a data input/output block which generates the internal data and the data input/output block includes a temporary storage part which stores the internal data as the temporary storage data, a data output part which receives the temporary storage data, and a data input part which receives an output of the data output part and outputs it as the internal data.

CROSS-REFERENCES TO RELATED APPLICATION

The present application claims priority under 35 U.S.C. §119(a) toKorean application number 10-2013-0103841, filed on Aug. 30, 2013, inthe Korean Intellectual Property Office, which is incorporated herein byreference in its entirety.

BACKGROUND

1. Technical Field

Various embodiments relate to a semiconductor integrated circuit, andmore particularly, to a semiconductor memory apparatus.

2. Related Art

Generally, a semiconductor integrated circuit, for example, asemiconductor memory apparatus may include a plurality of pads forcommunication with a system. The pad may be disposed in a signaltransfer port of the semiconductor memory apparatus. As thesemiconductor memory apparatus is highly integrated and is scaled down,the size of the pads is gradually decreasing.

Currently, a pad increasingly used among pads with scaled-down sizes isa micro bump. Since the size of such a micro bump is small, it isdifficult to directly test the micro bump using the pin of testequipment. Although a test may be performed by mounting a semiconductormemory apparatus including micro bumps, to a substrate (for example, aprinted circuit board: PCB), it is not in reason to test entiremass-produced semiconductor memory apparatuses by mounting them to asubstrate.

While a semiconductor memory apparatus with micro bumps may be tested byproviding test-pads with a size larger than the micro bumps, because thetest-pads have a large size, it is difficult to realize high densitysemiconductor memory apparatus integrated in a large number oftest-pads. Therefore, a technology capable of testing a semiconductormemory apparatus using a limited number of test pads is demanded.

SUMMARY

In an embodiment of the present invention, a semiconductor integratedcircuit includes: a test input/output port including a plurality of testpads; an internal input interface configured to generate an internalclock, an internal address, an internal command, internal data andtemporary storage data in response to external signals through the testinput/output port; and an error detection block configured to determinewhether the internal data and the temporary storage data are the samewith each other, and output a determination result through one test padof the test input/output port, wherein the internal input interfaceincludes a data input/output block which generates the internal data,and wherein the data input/output block includes a temporary storagepart which stores the internal data as the temporary storage data, adata output part which receives the temporary storage data, and a datainput part which receives an output of the data output part and outputsit as the internal data.

In an embodiment of the present invention, a system comprising asemiconductor integrated circuit block, wherein the semiconductorintegrated circuit block comprises: a test port including a plurality oftest pads; an internal input interface configured to generate aninternal signal and temporary storage data using the external signalsprovided through the test port; and an error detection block configuredto compare the internal signal and the temporary storage data and outputa comparing result through selected one of the plurality of test pads.

In an embodiment of the present invention, a system comprising asemiconductor integrated circuit block, wherein the semiconductorintegrated circuit block is configured to include a plurality of testpads inputted signals for testing the semiconductor integrated circuitblock, and a test result of the semiconductor integrated circuit blockis outputted through at least one of the plurality of the test pads.

BRIEF DESCRIPTION OF THE DRAWINGS

Features, aspects, and embodiments are described in conjunction with theattached drawings, in which:

FIG. 1 is a block diagram of a semiconductor memory apparatus inaccordance with an embodiment of the present disclosure;

FIG. 2 is a block diagram of the first test input block of FIG. 1;

FIG. 3 is a block diagram of the address input block of FIG. 1;

FIG. 4 is a block diagram of the clock input block of FIG. 1;

FIG. 5 is a timing diagram explaining the semiconductor memory apparatusin accordance with the embodiment of the present disclosure;

FIG. 6 is a block diagram of a semiconductor memory apparatus inaccordance with an embodiment of the present disclosure;

FIG. 7 is a block diagram of the second test input block of FIG. 6;

FIG. 8 is a block diagram of the data input/output block of FIG. 6;

FIG. 9 is a block diagram of the strobe signal input block of FIG. 6;and

FIG. 10 is a block diagram of a semiconductor memory apparatus inaccordance with an embodiment of the present disclosure, including thesemiconductor memory apparatuses of FIGS. 1 and 6.

FIG. 11 is a block diagram of various features of an electronic system,according to various embodiments of the invention.

DETAILED DESCRIPTION

Hereinafter, a semiconductor memory apparatus according to the presentinvention will be described below with reference to the accompanyingdrawings through exemplary embodiments.

As shown in FIG. 1, a semiconductor memory apparatus 1000 may include afirst test input block 100, an address input block 200 and a clock inputblock 300.

The first test input block 100 may be configured to receive an addressDA_ADD, a reference voltage VREF and clocks DA_CLK, DA_CLKB, DA_QCLK andDA_QCLKB which are externally inputted from test pads 10.

The test pad 10 may include a probe pad, a direct access pad, or thelike. The address DA_ADD which is externally inputted is referred to asan external address DA_ADD, and the clocks DA_CLK and DA_CLKB which areexternally inputted are respectively referred to as an external clockDA_CLK and an external clock bar DA_CLKB. Also, the clocks DA_QCLK andDA_QCLKB which are externally inputted are respectively referred to asan external write clock DA_QCLK and an external write clock barDA_QCLKB.

The first test input block 100 may be configured to compare the voltagelevel of the external address DA_ADD and the voltage level of thereference voltage VREF, and generate a rising address ADDR bysynchronizing a comparison result with the external clock DA_CLK.Further, the first test input block 100 may be configured to compare thevoltage level of the external address DA_ADD and the voltage level ofthe reference voltage VREF, and generate a falling address ADDF bysynchronizing a comparison result with the external clock bar DA_CLKB.The first test input block 100 may be driven the external clock DA_CLK,the external clock bar DA_CLKB, the external write clock DA_QCLK and theexternal write clock bar DA_QCLKB thereby generating an input clockCLK_i, an input clock bar CLKB_i, a write input clock QCLK_i and a writeinput clock bar QCLKB_i, respectively.

The address input block 200 may be configured to receive the risingaddress ADDR, the falling address ADDF, write input clock

QCLK_i and the write input clock bar QCLKB_i from the first test inputblock 100. The clock input block 300 may be configured to receive theinput clock CLK_i and the input clock bar CLKB_i.

More detailed, referring to FIG. 2, the first test input block 100 mayinclude a comparison unit 110, first and second latch units 120 and 130,and first to fourth drivers 140, 150, 160 and 170.

The comparison unit 110 may receive the external address DA_ADD and thereference voltage VREF. The comparison unit 110 may be configured tocompare the voltage level of the external address DA_ADD and the voltagelevel of the reference voltage VREF. For example, the comparison unit110 may be configured to be output a signal with a high level when thevoltage level of the external address DA_ADD is higher than the voltagelevel of the reference voltage VREF, and output a signal with a lowlevel when the voltage level of the external address DA_ADD is lowerthan the voltage level of the reference voltage VREF.

The first latch unit 120 may be configured to latch the output of thecomparison unit 110 in response to the external clock DA_CLK, and outputa latched signal as the rising address ADDR. For example, the firstlatch unit 120 may latch the output of the first comparison unit 110 atthe rising timing of the external clock DA_CLK, and output the risingaddress ADDR.

The second latch unit 130 may be configured to latch the output of thecomparison unit 110 in response to the external clock bar DA_CLKB, andoutput a latched signal as the falling address ADDF. For example, thesecond latch unit 130 may latch the output of the first comparison unit110 at the rising timing of the external clock bar DA_CLKB, and outputthe falling address ADDF.

The first driver 140 may be configured to drive the external clockDA_CLK thereby outputting the input clock CLK_i.

The second driver 150 may be configured to drive the external clock barDA_CLKB thereby outputting the input clock bar CLKB_i.

The third driver 160 may be configured to drive the external write clockDA_QCLK thereby outputting the write input clock QCLK_i.

The fourth driver 170 may be configured to drive the external writeclock bar DA_QCLKB and output the write input clock bar QCLKB_i.

The address input block 200 of FIG. 1 may be configured to generate aPHY (physical layer) address PHY_ADD in response to the rising addressADDR, the falling address ADDF, the write input clock QCLK_i and thewrite input clock bar QCLKB_i, and output the PHY address PHY_ADD as aninternal address INT_ADD.

Referring to FIG. 3, the address input block 200 may include a firstlatch unit 210, a second latch unit 220, a first multiplexer 230, atransmission unit 240, a reception unit 250, and a second multiplexer260.

The first latch unit 210 may be configured to output the rising addressADDR in synchronization with the write input clock QCLK_i. For example,the first latch unit 210 latches and outputs the rising address ADDR atthe rising timing of the write input clock QCLK_i.

The second latch unit 220 may be configured to output the fallingaddress ADDF in synchronization with the write input clock bar QCLKB_i.For example, the second latch unit 220 latches and outputs the fallingaddress ADDF at the rising timing of the write input clock bar QCLKB_i.

The first multiplexer 230 may be configured to select one of the outputof the first latch unit 210 and the output of the second latch unit 220as the PHY address PHY_ADD in response to the write input clock QCLK_i.For example, the first multiplexer 230 selects the output of the firstlatch unit 210 as the PHY address PHY_ADD when the write input clockQCLK_i is a high level, and selects the output of the second latch unit220 as the PHY address PHY_ADD when the write input clock QCLK_i is alow level.

The transmission unit 240 may be configured to be activated in responseto a first test control signal Test_ctrlA, and output the PHY addressPHY_ADD to an address bump ADD_bump. For example, the transmission unit240 may be activated when the first test control signal Test_ctrlA isenabled, and may transfer the PHY address PHY_ADD to the address bumpADD_bump. The transmission unit 240 may be deactivated when the firsttest control signal Test_ctrlA is disabled, and may block the PHYaddress PHY_ADD from being transferred to the address bump ADD_bump. Theaddress bump ADD_bump may include a configuration for transferring thereceived address to an internal circuit (not shown) when a normaloperation (not testing operation) although the address bump ADD_bumpincludes a type of a micro bump. The transmission unit 240 may beconstituted by a general driver.

The reception unit 250 may be configured to receive the PHY addressPHY_ADD inputted through the address bump ADD_bump, and provide the PHYaddress PHY_ADD to the second multiplexer 260. The reception unit 250may be constituted by a general receiver.

The second multiplexer 260 may be configured to output the PHY addressPHY_ADD outputted from the first multiplexer 230, as the internaladdress INT_ADD, or output the PHY address PHY_ADD outputted from thereception unit 250, as the internal address INT_ADD, in response to asecond test control signal Test_ctrlB. For example, the secondmultiplexer 260 selects the output of the first multiplexer 230 as theinternal address INT_ADD when the second test control signal Test_ctrlBis enabled, and selects the output of the reception unit 250 as theinternal address INT_ADD when the second test control signal Test_ctrlBis disabled.

If an external command (not shown) instead of the external addressDA_ADD is inputted to the first test input block 100 of FIG. 1, theaddress input block 200 may output an internal command (not shown). Thatis to say, a configuration for generating the external address DA_ADD asthe internal address INT_ADD and a configuration for generating theexternal command as the internal command are the same with each other.The semiconductor memory apparatus may transfer an address and a commandto the inside of the semiconductor memory apparatus by the configurationas shown in FIG. 1.

The clock input block 300 of FIG. 1 may be configured to generate a PHY(physical layer) clock PHY_CLK in response to the input clock CLK_i andthe input clock bar CLKB_i, and output the PHY clock PHY_CLK as aninternal clock INT_CLK.

Referring to FIG. 4, the clock input block 300 may include first andsecond latch units 310 and 320, a first multiplexer 330, a transmissionunit 340, a reception unit 350, and a second multiplexer 360.

The first latch unit 310 may be configured to latch and output a groundvoltage VSS, that is, a low level signal, each time the input clockCLK_i transitions to a high level.

The second latch unit 320 may be configured to latch and output anexternal voltage VDD, that is, a high level signal, each time the inputclock bar CLKB_i transitions to a high level.

The first multiplexer 330 may be configured to select one of outputsignals of the first and second latch units 310 and 320 as the PHY clockPHY_CLK in response to the input clock CLK_i. For example, the firstmultiplexer 330 selectively outputs the output signal of the first latchunit 310 as the PHY clock PHY_CLK when the input clock CLK_i is the highlevel, and selectively outputs the output signal of the second latchunit 320 as the PHY clock PHY_CLK when the input clock CLK_i is a lowlevel.

The transmission unit 340 may be configured to be activated in responseto the first test control signal Test_ctrlA, and output the PHY clockPHY_CLK to a clock bump CLK_bump. For example, the transmission unit 340is activated when the first test control signal Test_ctrlA is enabled,and provides the PHY clock PHY_CLK to the clock bump CLK_bump. Thetransmission unit 340 blocks the PHY clock PHY_CLK from beingtransferred to the clock bump CLK_bump when the first test controlsignal Test_ctrlA is disabled. The transmission unit 340 may beconstituted by a driver.

The reception unit 350 may be configured to transfer the PHY clockPHY_CLK which is inputted from the clock bump CLK_bump, to the secondmultiplexer 360. The reception unit 350 may be to constituted by areceiver.

The second multiplexer 360 may be configured to output one of the PHYclock PHY_CLK outputted from the first multiplexer 330 and the PHY clockPHY_CLK outputted from the reception unit 350 as the internal clockINT_CLK in response to the second test control signal Test_ctrlB. Forexample, the second multiplexer 360 selects the output of the firstmultiplexer 330 as the internal clock INT_CLK when the second testcontrol signal Test_ctrlB is enabled, and selects the output of thereception unit 350 as the internal clock INT_CLK when the second testcontrol signal Test_ctrlB is disabled.

Operations of the first test input block 100, the address input block200 and the clock input block 300 shown in FIG. 1 will be described withreference to FIG. 5.

The external clock DA_CLK and the external address DA_ADD are inputtedto the first test input block 110.

A result AR of comparing the voltage levels of the external addressDA_ADD and the reference voltage VREF is latched in the first latch unit120 and outputted as the rising address ADDR from the rising timing ofthe external clock DA_CLK, that is, from when the external clock DA_CLKtransitions to the high level to until the external clock DA_CLK nexttransitions to the high level.

A result AF of comparing the voltage levels of the external addressDA_ADD and the reference voltage VREF is latched in the second latchunit 130 and outputted as the falling address ADDF from the fallingtiming of the external clock DA_CLK, that is, from when the externalclock DA_CLK transitions to the low level to until the external clockDA_CLK next transitions to the low level.

The rising address ADDR is outputted as the PHY address PHY_ADD duringthe high level period of the external write clock DA_QCLK, and thefalling address ADDF is outputted as the PHY address PHY_ADD during thelow level period of the external write clock DA_QCLK.

The PHY clock PHY_CLK is outputted at the level of the ground voltageVSS, that is, a low level, during the high level period of the externalclock DA_CLK, and is outputted at the level of the external voltage VDD,that is, a high level, during the low level period of the external clockDA_CLK. In other words, the PHY clock PHY_CLK may have a phase oppositeto the phase of the external clock DA_CLK. The external clock DA_CLK,the external clock bar DA_CLKB, the external write clock DA_QCLK and theexternal write clock bar DA_QCLKB shown in FIGS. 1 to 4 respectively mayhave the same phases as the input clock CLK_i, the input clock barCLKB_i, the write input clock QCLK_i and the write input clock barQCLKB_i which are outputted as the external clock DA_CLK, the externalclock bar DA_CLKB, the external write clock DA_QCLK and the externalwrite clock bar DA_QCLKB are driven. Also, the external clock DA_CLK andthe external clock bar DA_CLKB have opposite phases, and the externalwrite clock DA_QCLK and the external write clock bar DA_QCLKB haveopposite phases.

As shown in FIG. 6, a semiconductor memory apparatus 2000 may include asecond test input block 400, a data input/output block 500, and a strobesignal input block 600.

For example, the semiconductor memory apparatus 2000 shown in FIG. 6 isa device for processing data signal and the above semiconductor memoryapparatus 1000 shown in FIG. 1 is a device for processing an address (ora command) and a clock.

The second test input block 400 may be configured to receive data DA_DQ,a reference voltage VREF, clocks DA_CLK and DA_CLKB and data strobesignals DA_DQS and DA_DQSB which are externally inputted from a testpad60. The test pad 60 may be a probe pad, a direct access pad, or thelike. The data DA_DQ which is externally inputted is referred to asexternal data DA_DQ, and the clocks DA_CLK and DA_CLKB which areexternally inputted are respectively referred to as an external clockDA_CLK and an external clock bar DA_CLKB. Further, the data strobesignals DA_DQS and DA_DQSB which are externally inputted arerespectively referred to as an external data strobe signal DA_DQS and anexternal data strobe bar signal DA_DQSB.

The second test input block 400 may be configured to compare the voltagelevel of the external data DA_DQ and the voltage level of the referencevoltage VREF, and generate rising data DATAR as a first comparisonresult by synchronizing the first comparison result with the externalclock DA_CLK. Further, the second test input block 400 may be configuredto compare the voltage level of the external data DA_DQ and the voltagelevel of the reference voltage VREF, and generate falling data DATAF asa second comparison result by synchronizing the second comparison resultwith the external clock bar DA_CLKB. The second test input block 400 maybe configured to drive the external data strobe signal DA_DQS and theexternal data strobe bar signal DA_DQSB, and generate an input datastrobe signal DQS_i and an input data strobe bar signal DQSB_i. The datainput/output block 500 may be configured to receive the rising dataDATAR and the falling data DATAF from the second test input block 400.The strobe signal input block 600 may be configured to receive the inputdata strobe signal DQS_i and an input data strobe bar signal DQSB_i fromthe second test input block 400.

More detailed, referring to FIG. 7, the second test input block 400 mayinclude a comparison unit 410, first and second latch units 420 and 430,and first and second drivers 440 and 450.

The comparison unit 410 may be configured to receive the external dataDA_DQ and the reference voltage VREF and compare the voltage level ofthe external data DA_DQ and the voltage level of the reference voltageVREF. For example, the comparison unit 410 may be configured to beoutput a signal with a high level when the voltage level of the externaldata DA_DQ is higher than the voltage level of the reference voltageVREF, and output a signal with a low level when the voltage level of theexternal data DA_DQ is lower than the voltage level of the referencevoltage VREF.

The first latch unit 420 may be configured to latch the output of thecomparison unit 410 in response to the external clock DA_CLK, and outputa latched signal as the rising data DATAR. For example, the first latchunit 420 may latch the output of the first comparison unit 410 at therising timing of the external clock DA_CLK, and output the rising dataDATAR.

The second latch unit 430 may be configured to latch the output of thecomparison unit 410 in response to the external clock bar DA_CLKB, andoutput a latched signal as the falling data DATAF. For example, thesecond latch unit 430 may latch the output of the first comparison unit410 at the rising timing of the external clock bar DA_CLKB, and outputthe falling data DATAF.

The first driver 440 may be configured to drive the external data strobesignal DA_DQS thereby outputting the input data strobe signal DQS_i.

The second driver 450 may be configured to drive the external datastrobe bar signal DA_DQSB thereby outputting the input data strobe barsignal DQSB_i.

The data input/output block 500 of FIG. 6 may be configured to transferthe rising data DATAR and the falling data DATAF to first and secondinput data lines RXR_L and RXF_L in response to a write data stroberising signal WDQS_R and a write data strobe falling signal WDQS_F.Also, the data input/output block 500 may be configured to receive datafrom first and second output data lines TXR_L and TXF_L. The datainput/output block 500 may be electrically coupled with a datainput/output bump DQ_bump.

Referring to FIG. 8, the data input/output block 500 may include a datainput part 510, a data output part 520, and a temporary storage part530.

The data input part 510 may be configured to transfer PHY data PHY_DQinputted from the data input/output bump DQ_bump or PHY data PHY_DQinputted from the data output part 520, to the first and second inputdata lines RXR_L and RXF_L in synchronization with the write data stroberising signal WDQS_R and the write data strobe falling signal WDQS_F.

The data input part 510 may include a reception unit 511, and first andsecond latch units 512 and 513.

The reception unit 511 may be configured to receive the PHY data PHY_DQand transfer the PHY data PHY_DQ to the first and second latch units 512and 513. The reception unit 511 may be constituted by a receiver.

The first latch unit 512 may be configured to provide an output data ofthe reception unit 511 to the first input data line RXR_L in response tothe write data strobe rising signal WDQS_R. For example, the first latchunit 512 may latch the output data of the reception unit 511 and outputthe latched output of the reception unit 511 to the first input dataline RXR_L each time the write data strobe rising signal WDQS_Rtransitions to a high level.

The second latch unit 513 may be configured to provide the output dataof the reception unit 511 to the second input data line RXF_L inresponse to the write data strobe falling signal WDQS_F. For example,the second latch unit 513 may latch the output data of the receptionunit 511 and output the latched output of the reception unit 511 to thesecond input data line RXF_L each time the write data strobe fallingsignal WDQS_F transitions to a high level.

The data output part 520 may be configured to output one of the signalsof the first and second output data lines TXR_L and TXF_L, outputsignals R1_OUT and R2_OUT of the temporary storage part 530, and theoutput signals DATAR and DATAF of the second test input block 400, tothe data input/output bump DQ_bump and the reception unit 511 of thedata input part 510.

The data output part 520 may include first to sixth multiplexers 521 to526, and a transmission unit 527.

The first multiplexer 521 may be configured to select one of the outputsignal R1_OUT of the temporary storage part 530 and the signal of thefirst output data line TXR_L in response to a first test control signalTest_ctrl1. For example, the first multiplexer 521 may output the signalof the first output data line TXR_L when the first test control signalTest_ctrl1 is enabled, and output the output signal R1_OUT of thetemporary storage part 530 when the first test control signal Test_ctrl1is disabled.

The second multiplexer 522 may be configured to output one of the outputsignal R2_OUT of the temporary storage part 530 and the signal of thesecond output data line TXF_L in response to the first test controlsignal Test_ctrl1. For example, the second multiplexer 522 may outputthe signal of the second output data line TXF_L when the first testcontrol signal Test_ctrl1 is enabled, and output the output signalR2_OUT of the temporary storage part 530 when the first test controlsignal Test_ctrl1 is disabled.

The third multiplexer 523 may be configured to select one clock of anoutput clock TXCLK and a write input clock QCLK_i in response to asecond test control signal Test_ctrl2. For example, the thirdmultiplexer 523 may output the write input clock QCLK_i when the secondtest control signal Test_ctrl2 is enabled, and output the output clockTXCLK when the second test control signal Test_ctrl2 is disabled. Theoutput clock TXCLK may be a clock which is used for a read operation notin a testing operation but in a normal operation, and the write inputclock QCLK_i may be the clock which is shown in FIG. 1.

The fourth multiplexer 524 may be configured to select one of the risingdata DATAR and the falling data DATAF in response to the write inputclock QCLK_i. For example, the fourth multiplexer 524 may output therising data DATAR when the write input clock QCLK_i is a high level, andoutput the falling data DATAF when the write input clock QCLK_i is a lowlevel.

The fifth multiplexer 525 may be configured to select one of the outputof the first multiplexer 521 and the output of the second multiplexer522 in response to the output of the third multiplexer 523. For example,the fifth multiplexer 525 may output the output of the first multiplexer521 when the output of the third multiplexer 523 is a high level, andoutput the output of the second multiplexer 522 when the output of thethird multiplexer 523 is a low level.

The sixth multiplexer 526 may be configured to output one of the outputof the fifth multiplexer 525 and the output of the fourth multiplexer524 in response to a third test control signal Test_ctrl3. For example,the sixth multiplexer 526 may output the output of the fifth multiplexer525 to the transmission unit 527 when the third test control signalTest_ctrl3 is enabled, and output the output of the fourth multiplexer524 to the transmission unit 527 when the third test control signalTest_ctrl3 is disabled.

The transmission unit 527 may be configured to provide the output of thesixth multiplexer 526 to the data input/output bump DQ_bump and thereception unit 511. The transmission unit 527 may be constituted by adriver.

The first and second multiplexers 521 and 522 may be component elementswhich select one of the outputs R1_OUT and R2_OUT of the temporarystorage part 530 and the signals of the first and second output datalines TXR_L and TXF_L according to the first test control signalTest_ctrl1. The third multiplexer 523 may be a component element whichselects the clock TXCLK used in a normal operation and the clock QCLK_iused in a test according to the second test control signal Test_ctrl2.The fourth multiplexer 524 may be a component element which synchronizesthe rising data DATAR and the falling data DATAF with a clock used in atest, that is, the write input clock QCLK_i. The fifth multiplexer 525may be a component element which synchronizes the outputs of the firstand second multiplexers 521 and 522 with the output of the thirdmultiplexer 523. The sixth multiplexer 526 is a component element whichtransfers one of the output of the fourth multiplexer 524 and the outputof the fifth multiplexer 525 to the transmission unit 527 in response tothe third test control signal Test_ctrl3. The data input/output bumpDQ_bump may be electrically coupled to a node through which thetransmission unit 527. The reception unit 511 may be electricallycoupled with each other, and the signal of the node at which thetransmission unit 527. The reception unit 511 and the data input/outputbump DQ_bump may be electrically coupled is the PHY data PHY_DQ. Namely,the output of the transmission unit 527 may be the PHY data PHY_DQ, andthe input of the reception unit 511 may be the PHY data PHY_DQ.

The temporary storage part 530 may be configured to store the outputs ofthe data input part 510 and transfer stored signals to the first andsecond multiplexers 521 and 522 of the data output part 520, in responseto a fourth test control signal Test_ctrl4. For example, the temporarystorage part 530 may store the outputs of the data input part 510 andprovides the stored signals to the first and second multiplexers 521 and522 of the data output part 520 when the fourth test control signalTest_ctrl4 is enabled. Further, the temporary storage part 530 does notreceive the outputs of the data input part 510 and outputs the values ofpreviously stored signals when the fourth test control signal Test_ctrl4is disabled.

The temporary storage part 530 may include first and second switches 531and 532, and a register 533.

The first switch 531 may be configured to transfer the output of thefirst latch unit 512 to the register 533 when the fourth test controlsignal Test_ctrl4 is enabled. The first switch 531 may be configured toblock the output of the first latch unit 512 from being transferred tothe register 533 when the fourth test control signal Test_ctrl4 isdisabled.

The second switch 532 may be configured to transfer the output of thesecond latch unit 513 to the register 533 when the fourth test controlsignal Test_ctrl4 is enabled. The second switch 532 may be configured toblock the output of the second latch unit 513 from being transferred tothe register 533 when the fourth test control signal Test_ctrl4 isdisabled.

The register 533 may be configured to store the outputs of the first andsecond switches 531 and 532, and output the stored signals to the firstand second multiplexers 521 and 522. For example, the register 533 maystore the output of the first switch 531, and output the stored outputof the first switch 531 to the first multiplexer 521. Also, the register531 may store the output of the second switch 532 and output the storedsignal provided from the second switch 532 to the second multiplexer522.

The strobe signal input block 600 of FIG. 6 may be configured togenerate the write data strobe rising signal WDQS_R and the write datastrobe falling signal WDQS_F in response to the input data strobe signalDQS_i and the input data strobe bar signal DQSB_i. Further, the strobesignal input block 600 may be electrically coupled to a data strobe bumpDQS_bump, and generate the write data strobe rising signal WDQS_R andthe write data strobe falling signal WDQS_F in response to the signalinputted from the data strobe bump DQS_bump in a normal operation.

Referring to FIG. 9, the strobe signal input block 600 may include firstand second latch units 610 and 620, a multiplexer 630, a transmissionunit 640, and a reception unit 650.

The first latch unit 610 may be configured to latch and output anexternal voltage VDD, that is, a high level signal, in response to theinput data strobe signal DQS_i. For example, the first latch unit 610may output the high level signal each time the input data strobe signalDQS_i transitions to a high level.

The second latch unit 620 may configured to latch and output a groundvoltage VSS, that is, a low level signal, in response to the input datastrobe bar signal DQSB_i. For example, the second latch unit 620 outputsthe low level signal each time the input data strobe bar signal DQSB_itransitions to a high level.

The multiplexer 630 may be configured to select one of the outputs ofthe first latch unit 610 and the second latch unit 620 in response tothe input data strobe signal DQS_i. For example, the multiplexer 630 mayoutput the output of the first latch unit 610 to the transmission unit640 when the input data strobe signal DQS_i is the high level, andoutput the output of the second latch unit 620 to the transmission unit640 when the input data strobe signal DQS_i is a low level.

The transmission unit 640 may be configured to receive the output of themultiplexer 630, and output it to the data strobe bump DQS_bump and thereception unit 650.

The reception unit 650 may be configured to receive the signal outputtedfrom the transmission unit 640 or the signal inputted from the datastrobe bump DQS_bump and output the write data strobe rising signalWDQS_R. Further the reception unit 650may invert the signal outputtedfrom the transmission unit 640 or the signal inputted from the datastrobe bump DQS_bump and output the write data strobe falling signalWDQS_F. The signal inputted to or outputted from a node at which thetransmission unit 640, the reception unit 650 and the data strobe bumpDQS_bump are electrically coupled may be a PHY data strobe signalPHY_DQ.

FIG. 10 shows a semiconductor memory apparatus 3000 in accordance withan embodiment of the present disclosure, in which both the semiconductormemory apparatus 1000 of FIG. 1 relating to addresses, commands andclocks and the semiconductor memory apparatus 2000 of FIG. 6 relating todata are used.

The semiconductor memory apparatus 3000 shown in FIG. 10 may include atest input/output port 700, an internal input interface 800, and anerror detection block 900.

The test input/output port 700 may include a plurality of test pads700_1, 700_2, . . . and 700 _(—) n, and may be configured to transfer anaddress, a command, a clock and data which are applied from an externalcircuit device, to the internal input interface 800.

The internal input interface 800 may include the semiconductor memoryapparatus 1000 shown in FIG. 1 and the semiconductor memory apparatus2000 shown in FIG. 6, and may be configured to generate an internalclock INT_CLK, an internal address INT_ADD, an internal command INT_COM,internal data INT_DATA and temporary storage data R_out from the clock,the address, the command, the clock and the data which are inputted fromthe test input/output port 700. For example, the semiconductor memoryapparatus 1000 shown in FIG. 1 may generate the internal address INT_ADDand the internal clock INT_CLK in response to the external addressDA_ADD, the reference voltage VREF, the external clock DA_CLK and theexternal write clock DA_QCLK. Also, by using the semiconductor memoryapparatus 1000 shown in FIG. 1, an external command may be generated asthe internal command INT_COM. A configuration for generating theinternal address INT_ADD and a configuration for generating the internalcommand INT_COM are the same with each other except that input signalsand output signals thereof may be different. The semiconductor memoryapparatus 2000 shown in FIG. 6 may generate the internal data INT_DATAto be inputted to the input data lines RXR_L and RXF_L, by using theexternal data DA_DQ, the reference voltage VREF, the external clockDA_CLK and the external data strobe signal DA_DQS. Further, as theinternal data INT_DATA inputted to the input data lines RXR_L and RXF_Lis stored by the register 533 (see FIG. 8), the temporary storage dataR_out (R1_OUT and R2_OUT) is generated.

The error detection block 900 may be configured to compare the internaldata INT_DATA and the temporary storage data R_out to detect if they arethe same with each other, and output a comparison result to one test padwhich is configured in the test input/output port 700. The errordetection block 900 may be realized by an exclusive OR gate and an ANDgate.

Operations of the semiconductor memory apparatus 1000 relating theaddress signal shown in FIG. 1 will be described below.

Referring to FIG. 1, the first test input block 100 generates the risingaddress ADDR, the falling address ADDF, the write input clock QCLK_i,the write input clock bar QCLKB_i, the input clock CLK_i and the inputclock bar CLKB_i in response to the external address DA_ADD, thereference voltage VREF, the external clock DA_CLK, the external clockbar DA_CLKB, the external write clock DA_QCLK and the external writeclock bar DA_QCLKB using the an address DA_ADD, a reference voltage VREFand clocks DA_CLK, DA_CLKB, DA_QCLK and DA_QCLKB.

The address input block 200 generates the internal address INT_ADD inresponse to the rising address ADDR, the falling address ADDF, the writeinput clock QCLK_i and the write input clock bar QCLKB_i using therising address ADDR, the falling address ADDF, write input clock QCLK_iand the write input clock bar QCLKB_i from the first test input block100.

In detail, referring to FIG. 3, in a test, the first test control signalTest_ctrlA is enabled, and the PHY address PHY_ADD generated by thefirst multiplexer 230 is outputted to the address bump ADD_bump and thereception unit 250. The reception unit 250 receives the output of thetransmission unit 240 and outputs it to the second multiplexer 260. Inthe case where the second test control signal Test_ctrlB is disabled,the second multiplexer 260 selects and outputs the output of thereception unit 250 as the internal address INT_ADD. The PHY addressPHY_ADD is generated from the rising address ADDR and the fallingaddress ADDF which are generated from the external address DA_ADD, thereference voltage VREF, the external clock DA_CLK and the external clockbar DA_CLKB inputted from a test pad. As the PHY address PHY_ADD isinputted to the reception unit 250 through the address bump ADD_bump,the same path as the path of the address which is inputted to thereception unit 250 from the address bump ADD_bump in a normal operationis formed. In the case where it is necessary to use the PHY addressPHY_ADD not having passed through the transmission unit 240 and thereception unit 250, as the internal address INT_ADD, the second testcontrol signal Test_ctrlB is disabled.

A configuration for generating an external command as an internalcommand is the same as the configuration for generating the externaladdress DA_ADD as the internal address INT_ADD.

The clock input block 300 generates the internal address INT_ADD inresponse to the input clock CLK_i and the input clock bar CLKB_i.

In detail, referring to FIG. 4, the output of the first multiplexer 330,that is, the PHY clock PHY_CLK is outputted as the internal clockINT_CLK through the transmission unit 340, the clock bump CLK_bump, thereception unit 350 and the second multiplexer 360. In this case, in thesame manner as in the normal operation, the reception unit 350 receivesa signal from the clock bump CLK_bump and outputs the internal clockINT_CLK through the second multiplexer 360. Further, under the controlof the first and second test control signals Test_ctrlA and Test_ctrlB,the output of the first multiplexer 330 is outputted as the internalclock INT_CLK directly through the second multiplexer 360 withoutpassing through the clock bump CLK_bump and the reception unit 350.

Therefore, the semiconductor memory apparatus 1000 shown in FIG. 1 mayinput the internal address INT_ADD, the internal command INT_COM and theinternal clock INT_CLK to other internal circuits through the same inputpaths of an address, a command and a clock as in the normal operation,in a test.

Operations of the semiconductor memory apparatus 2000 relating datashown in FIG. 6 will be described below.

The second test input block 400 generates the rising data DATAR, thefalling data DATAF, the input data strobe signal DQS_i and the inputdata strobe bar signal DQSB_i in response to the external data DA_DQ,the reference voltage VREF, the external clock DA_CLK, the externalclock bar DA_CLKB, the external data strobe signal DA_DQS and theexternal data strobe bar signal DA_DQSB.

The data input/output block 500 outputs the PHY data PHY_DQ (see FIG. 8)to the first and second input data lines RXR_L and RXF_L as the internaldata INT_DATA in response to the rising data DATAR, the falling dataDATAF, the write data strobe rising signal WDQS_R and the write datastrobe falling signal WDQS_F. Also, the data input/output block 500 mayoutput the data received from the first and second output data linesTXR_L and TXF_L to the data bump DQ_bump.

In detail, referring to FIG. 8, the data input/output block 500 includesthe data input part 510, the data output part 520, and the temporarystorage part 530.

The data input part 510 transfers the PHY data PHY_DQ to the first andsecond input data lines RXR_L and RXF_L.

The data output part 520 selects one of the signals of the first andsecond output data lines TXR_L and TXF_L, the output signals R1_OUT andR2_OUT of the register 533, and the rising data DATAR and the fallingdata DATAF in response to the first to third test control signalsTest_ctrl1, Test_ctrl2 and Test_ctrl3, and generates the PHY data PHY_DQaccording to selected signals.

Thus, it is possible to input data through the same data paths as in anormal operation in which data pass from the data input part 510 throughthe input data lines RXR_L and RXF_L.

The temporary storage part 530 may store the data inputted through thefirst and second input data lines RXR_L and RXF_L and may output thetemporary storage data R1_OUT and R2_OUT.

Referring to FIG. 10, the semiconductor memory apparatus 3000 inaccordance with the embodiment of the present disclosure may input anaddress, a clock, a command and data through the same paths includingthe test input/output port 700 as in a normal operation, in a test.Because the semiconductor memory apparatus may input an address, aclock, a command and data through the same paths including the testinput/output port 700 as in a normal operation, in a test, thesemiconductor memory apparatus may perform a normal operation such as ofoutputting stored data and storing inputted data, in a test. Further,because an address, a clock, a command and data may be inputted to thesemiconductor memory apparatus through the reception units which areelectrically coupled with respective bumps for an address, a clock, acommand and data inputted from an outside, it is possible to checkwhether the respective reception units normally operate.

As the error detection unit 900 is included, it is possible to detectwhether the internal data INT_DATA inputted to the semiconductor memoryapparatus and the temporary storage data R_out are the same with eachother, whereby it is possible to check whether the data input part 510and the data output part 520 operate normally. In detail, the output ofthe data output part 520 may be stored in the temporary storage part 530through the data input part 510, and the output of the temporary storagepart 530 may be inputted to the data output part 520. Therefore, sincethe same data may be inputted to the data input part 510 and the dataoutput part 520, by comparing temporary storage data and the dataoutputted from the data input part 510, it is possible to check whetherthe data input part 510 and the data output part 520 operate normally.

By disposing the semiconductor memory apparatus 3000 of FIG. 10 inrespective channels, the channels may be respectively tested.

FIG. 17 shows a block diagram of various features of an electronicsystem 4000, according to various embodiments of the invention. System4000 can include a controller 4100 and a memory device 4200. Memorydevice 4200 can be configured as a semiconductor integrated circuit, inaccordance with embodiments taught herein, and may be similar to oridentical to one or more of the embodiments discussed with respect toFIGS. 1-10. System 4000 may be formed in various ways such as couplingthe individual components of system 4100 together or integrating thecomponents into one or a number of chip-based units using conventionaltechniques. In an embodiment, system 4000 also includes an electronicapparatus 4300 and a bus 4400, where the bus 4400 provides electricalconductivity among the components of system 4000. In an embodiment, thebus 4400 includes an address bus, a data bus, and a control bus, eachindependently configured. In an alternative embodiment, the bus 4400uses common conductive lines for providing one or more of address, data,or control, the use of which is regulated by controller 4100. In anembodiment, electronic apparatus 4300 may include additional memory forthe intended functional applications of electronic system 4000.

The memory device 4200 are not limited to, dynamic random access memory,static random access memory, synchronous dynamic random access memory(SDRAM), synchronous graphics random access memory (SGRAM), double datarate dynamic ram (DDR), and double data rate SDRAM, arranged accordingto the various embodiments as taught herein. The memory device 4200, inaccordance with various embodiments as illustrated in FIGS. 1-10, may berealized in the read operation and the write operation using the testpads.

In various embodiments, peripheral device or devices 4500 are coupled tothe bus 4400. Peripheral devices 4400 may include displays, imagingdevices, printing devices, wireless devices, wireless interfaces (e.g.wireless transceivers), additional storage memory, control devices thatmay operate in conjunction with controller 4100, In an embodiment,controller 4100 may include one or more processors. In variousembodiments, system 4100 includes, but is not limited to, fiber opticsystems or devices, electro-optic systems or devices, optical systems ordevices, imaging systems or devices, and information handling systems ordevices such as wireless systems or devices, telecommunication systemsor devices, and computers.

As is apparent from the above descriptions, the semiconductor memoryapparatus according to the embodiments of the present disclosure maytest normal operations of a semiconductor memory apparatus by using testpads.

While certain embodiments have been described above, it will beunderstood to those skilled in the art that the embodiments describedare by way of example only. Accordingly, the semiconductor memoryapparatus described herein should not be limited based on the describedembodiments. Rather, the semiconductor memory apparatus described hereinshould only be limited in light of the claims that follow when taken inconjunction with the above description and accompanying drawings.

What is claimed is:
 1. A semiconductor integrated circuit comprising: atest input/output port including a plurality of test pads; an internalinput interface configured to generate an internal clock, an internaladdress, an internal command, internal data and temporary storage datain response to external signals through the test input/output port; andan error detection block configured to determine whether the internaldata and the temporary storage data are the same with each other, andoutput a determination result through one test pad of the testinput/output port, wherein the internal input interface includes a datainput/output block which generates the internal data, and wherein thedata input/output block comprises: a temporary storage part which storesthe internal data as the temporary storage data; a data output partwhich receives the temporary storage data; and a data input part whichreceives an output of the data output part and outputs it as theinternal data.
 2. The semiconductor integrated circuit according toclaim 1, wherein each of the plurality of test pads comprises a probingpad or a direct access pad.
 3. The semiconductor integrated circuitaccording to claim 1, wherein the internal input interface is configuredto compare voltage levels of a reference voltage and an external addressand output the internal address, the internal command and the internaldata.
 4. The semiconductor integrated circuit according to claim 3,wherein the internal input interface comprises: to a test input blockconfigured to generate a rising address, a falling address, a writeinput clock and an input clock in response to the external address, areference voltage, an external clock and an external write clock whichare applied from the test input/output port; an address input blockconfigured to generate a PHY (physical layer) address in response to therising address, the falling address and the write input clock, andoutput the PHY address as the internal address; and a clock input blockconfigured to generate a PHY clock in response to the input clock, andoutput the PHY clock as the internal clock.
 5. The semiconductorintegrated circuit according to claim 4, wherein the test input block isconfigured to compare a voltage level of the external address and thevoltage level of the reference voltage and output a comparison result asthe rising address and the falling address in synchronization with theexternal clock, wherein the test input block drives the external clockand outputs the input clock, and wherein the test input block drives theexternal write clock and outputs the write input clock.
 6. Thesemiconductor integrated circuit according to claim 4, wherein theaddress input block generates the PHY address by synchronizing therising address and the falling address with the write input clock, andwherein the address input block comprises: a transmission unitconfigured to output the PHY address to an is address bump and areception unit in response to a first test control signal; the receptionunit configured to output a signal which is transferred from thetransmission unit or the address bump; and a multiplexer configured tooutput the PHY address as the internal address or output an output ofthe reception unit as the internal address, in response to a second testcontrol signal.
 7. The semiconductor integrated circuit according toclaim 6, wherein the address bump is electrically coupled to a node atwhich the transmission unit and the reception unit are electricallycoupled.
 8. The semiconductor integrated circuit according to claim 4,wherein the clock input block generates the PHY clock by synchronizingan external voltage and a ground voltage with the input clock.
 9. Thesemiconductor integrated circuit according to claim 8 wherein the clockinput block comprises: a transmission unit configured to transfer thePHY clock to a clock bump and a reception unit in response to the firsttest control signal; the reception unit configured to output a signalwhich is transferred from the clock bump or the transmission unit; and amultiplexer configured to output the PHY clock as the internal clock oroutput an output of the reception unit as the internal clock, inresponse to the second test control signal.
 10. The semiconductorintegrated circuit according to claim 9, wherein the clock bump iselectrically coupled to a node at which the transmission unit and thereception unit are electrically coupled.
 11. The semiconductorintegrated circuit according to claim 3, wherein the internal inputinterface comprises: a test input block configured to generate risingdata, falling data and an input data strobe signal in response toexternal data, the reference voltage, an external clock and an externaldata strobe signal which are applied from the test input/output port;the data input/output block configured to transfer the rising data andthe falling data to input data lines as the internal data bysynchronizing them with a write data strobe rising signal and a writedata strobe falling signal; and a strobe signal generation blockconfigured to generate the write data strobe rising signal and the writedata strobe falling signal in response to the input data strobe signal.12. The semiconductor integrated circuit according to claim 11, whereinthe test input block is configured to compare a voltage level of theexternal data and a voltage level of the reference voltage and generatesthe rising data and the falling data by synchronizing a comparisonresult with the external clock, and wherein the test input block drivesthe external data strobe signal and outputs the input data strobesignal.
 13. The semiconductor integrated circuit according to claim 12,wherein the data input/output block comprises: the data input partconfigured to transfer an output signal of a data bump or the dataoutput part to the input data lines by synchronizing it with the writedata strobe rising signal and the write data strobe falling signal; thedata output part configured to output one of signals of output datalines, output signals of the temporary storage part, and the rising dataand the falling data, in synchronization with the write input clock inresponse to first to third test control signals; and the temporarystorage part configured to store data which are transferred to the inputdata lines by the data input part, in response to a fourth test controlsignal, and output stored data to the data output part.
 14. Thesemiconductor integrated circuit according to claim 13, wherein the dataoutput part is configured to select one of the signals of the outputdata lines and the output signals of the temporary storage part inresponse to the first test control signal, select one of an output clockand the write input clock in response to the second test control signal,and output a first signal by synchronizing the signal selected by thefirst test control signal with the clock selected by the second testcontrol signal, wherein the data output part is configured to output asecond signal by synchronizing the rising data and the falling data withthe write input clock, wherein the data output part is configured toselect one of the first signal and the second signal in response to thethird test control signal, and outputs a third signal, and wherein thedata output part is configured to receive the third signal and transfersit to the data bump and the data input part.
 15. The semiconductorintegrated circuit according to claim 13, wherein the temporary storagepart is configured to store the data which are transferred to the inputdata lines by the data input part, and outputs stored data to the dataoutput part, when the fourth test control signal is enabled, and whereinthe temporary storage part is configured to prevent the data of theinput data lines from being stored therein when the fourth test controlsignal is disabled.
 16. The semiconductor integrated circuit accordingto claim 13, wherein the data bump is electrically coupled to a node atwhich the data input part and the data output part are electricallycoupled, in common.
 17. The semiconductor integrated circuit accordingto claim 11, wherein the strobe signal generation block is configured tosynchronize an external voltage and a ground voltage with the input datastrobe signal, and wherein the strobe signal generation block comprises:a transmission unit configured to transfer a signal synchronized withthe input data strobe signal to a data strobe bump and a reception unitas a PHY data strobe signal; and the reception unit configured to outputa signal which is transferred from the transmission unit or the datastrobe bump, as the write data strobe rising signal, and output thewrite data strobe falling signal which has an opposite phase to thewrite data strobe rising signal.
 18. The semiconductor integratedcircuit according to claim 17, wherein the data strobe bump iselectrically coupled to a node at which the transmission unit and thereception unit are electrically coupled.
 19. A system comprising asemiconductor integrated circuit block: wherein the semiconductorintegrated circuit block comprises: a test port including a plurality oftest pads; an internal input interface configured to generate aninternal signal and temporary storage data using the external signalsprovided through the test port; and an error detection block configuredto compare the internal signal and the temporary storage data and outputa comparing result through selected one of the plurality of test pads.20. A system comprising a semiconductor integrated circuit block:wherein the semiconductor integrated circuit block is configured toinclude a plurality of test pads inputted signals for testing thesemiconductor integrated circuit block, and a test result of thesemiconductor integrated circuit block is outputted through at least oneof the plurality of the test pads.